Reliability Test

Evaluate a chip's lifespan, stability, and failure risk under various stress conditions to forecast its long-term
performance in real-world environments.

Environmental Stress Testing

Simulates the environmental conditions that devices may encounter during storage and operation.

Preconditioning

Applicable to surface-mount devices (SMD) only.

Biased Highly Accelerated Stress Test (BHAST)

Accelerates the simulation of moisture ingress into the package under humid conditions, providing faster results than conventional testing.

High Temperature High Humidity Reverse Bias (H3TRB)

Simulates operating conditions where components are subjected to bias under high-temperature, high-humidity environments, such as during rainy seasons or after vehicle washing.

Unbiased Highly Accelerated Stress Test (UHAST)

Provides an accelerated assessment of moisture penetration into the package in humid environments compared to conventional testing.

Pressure Cooker Test (PCT)

Provides an accelerated assessment of moisture penetration into the package in humid environments compared to conventional testing.

Temperature Cycling (TC)

Represents severe temperature fluctuations caused by day-night cycles, seasonal variations, and transitions from cold outdoor environments to high temperatures in the engine compartment after start-up.

Intermittent Life Test (ILT)

Simulates frequent start-stop loading conditions, such as those experienced by electric windows, wipers, and cooling fans.

Thermal Shock (TS)

Represents extreme temperature variations caused by vehicle day-night cycles, abrupt regional climate changes, and prolonged parking.

High Temperature Storage (HTS)

Primarily simulates scenarios where products are subjected to long-term parking or transportation/storage in hot climates.

Low Temperature Storage (LTS)

Primarily simulates scenarios where products are subjected to long-term parking or transportation/storage in extremely cold climates.

Accelerated Life Simulation Testing

Simulates the long-term reliability of devices under actual operating conditions.

High Temperature Reverse Bias (HTRB)

Devices are subjected to maximum rated operating voltage for extended periods in high-temperature environments (e.g., near the engine compartment).

High Temperature Gate Bias (HTGB)

For MOSFETs/IGBTs, simulates prolonged application of gate drive voltage under high-temperature conditions.

Dynamic High Temperature Reverse Bias (DHTRB)

Power Cycling

Simulates real operating conditions in which power modules undergo frequent switching and significant junction temperature fluctuations during acceleration, deceleration, and traffic congestion.

Power Cycling

Simulates real operating conditions in which power modules undergo frequent switching and significant junction temperature fluctuations during acceleration, deceleration, and traffic congestion.