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Reliability Test
Environmental Stress Testing
Preconditioning
Biased Highly Accelerated Stress Test (BHAST)
High Temperature High Humidity Reverse Bias (H3TRB)
Unbiased Highly Accelerated Stress Test (UHAST)
Pressure Cooker Test (PCT)
Temperature Cycling (TC)
Intermittent Life Test (ILT)
Thermal Shock (TS)
High Temperature Storage (HTS)
Low Temperature Storage (LTS)
Accelerated Life Simulation Testing
High Temperature Reverse Bias (HTRB)
High Temperature Gate Bias (HTGB)
Dynamic High Temperature Reverse Bias (DHTRB)
Power Cycling
Power Cycling
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Temperature Cycling (TC) TC
Represents severe temperature fluctuations caused by day-night cycles, seasonal variations, and transitions from cold outdoor environments to high temperatures in the engine compartment after start-up.
Test Description

AEC-Q101/JESD224-104 Appendix6/GJB548 Method1010/GJB128A-97 Method1036/IEC 60747-5-5/GB/T 2423.22

Test Objective

This test evaluates the ability of components and solder interconnections to withstand mechanical stress induced by alternating high and low temperature extremes, which may result in permanent changes in electrical and/or physical characteristics.

Testing Equipment & Instruments