AEC-Q101/JESD22A-110/IEC60749-4/GB/T
4973.4-2012/MIL-STD-883 Method 1038/GJB548 Method 1008
Weaknesses in the chip passivation structure or topology, as well as in edge sealing, are affected differently under humidity and electrical bias. Contaminants may also be transported by moisture into critical regions, potentially leading to failure.