Nondestructive Analysis

Inspecting and imaging the physical state and structural defects of components without damage,
enabling early fault detection and quality assurance.

Ultrasonic Scanning SAM

Test Description: JEDEC JESD22-B115

Utilizes the reflection and transmission characteristics of high-frequency ultrasonic waves. Reflections occur at interfaces between different media, and defect regions (such as delamination, voids, and cracks) generate characteristic reflection signals due to abrupt changes in material properties.

Test Objective:

Used to verify packaging process quality, screen for early failure risks, and assess reliability. The focus varies across different application stages, covering the entire lifecycle from R&D and mass production to qualification and failure analysis.

X-ray Inspection X-Ray

Test Description: IPC/JEDEC J-STD-035

Utilizes the penetration and attenuation characteristics of X-rays. The X-ray beam passes through semiconductor devices/modules and their packaging (e.g., metal housings, molding compounds, ceramic substrates). Different materials-such as silicon chips, copper bond wires, solder, and aluminum substrates-attenuate X-rays to varying degrees. The transmitted (non-attenuated) X-rays are captured by a detector, producing a contrast image of the internal structure. Defect regions (e.g., voids and cracks), due to the absence or reduction of material attenuation, appear as characteristic bright or dark areas, enabling clear defect visualization.

Test Objective:

Non-destructive inspection is performed on the internal, non-visible structures of semiconductor devices (chips, discrete devices) and power modules. It primarily addresses the identification and evaluation of packaging process defects and post-use structural failures. The objectives vary across different application stages:

R&D / Process Validation Stage: Verifies the rationality of packaging design (e.g., bond wire layout, solder fill design), identifies process limitations (e.g., consistency defects caused by molds or tooling), and optimizes packaging process parameters.
Mass Production Quality Control Stage: Serves as a non-destructive screening step for batch inspection, enabling rapid removal of devices with early-stage packaging defects, ensuring batch yield. It supports high-throughput inspection for consumer and industrial applications, as well as 100% inspection requirements for automotive- and military-grade products.
Post-Reliability Testing Stage: Determines whether internal structural failures (e.g., solder joint cracking, bond wire lift-off) have occurred after aging tests such as temperature cycling, power cycling, and vibration, providing direct evidence for root cause failure analysis.
Final Product Qualification Stage: Provides compliant inspection data on internal package integrity to support certifications such as AEC-Q101, AQG 324, and MIL-STD-883, meeting documentation requirements for qualification standards.