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Biased Highly Accelerated Stress Test (BHAST)
High Temperature High Humidity Reverse Bias (H3TRB)
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Pressure Cooker Test (PCT)
Temperature Cycling (TC)
Intermittent Life Test (ILT)
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High Temperature Reverse Bias (HTRB)
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Dynamic High Temperature Reverse Bias (DHTRB)
Power Cycling
Power Cycling
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Intermittent Life Test (ILT) IOL
Simulates frequent start-stop loading conditions, such as those experienced by electric windows, wipers, and cooling fans.
Test Description

AEC-Q101/MIL-STD-750 Method 1037/GJB548 Method1006/GJB128A-97 Method10372

Test Objective

In short-duration (seconds-level) power cycling, the brief Ton and Toff result in rapid increases in junction temperature, while the case temperature (Tc) rises more gradually. This creates localized thermal stress concentrated near the chip interfaces, primarily evaluating the reliability of chip bonding and die-to-substrate solder joints.

Testing Equipment & Instruments