Discrete device:AEC-Q101/JESD22A-101/GJB548 Method 1004 Humidity Testing/GJB360 method1 08 Moisture Resistance/IEC 60747-5-5/GB/T 2423.37
Module:GJB548B Method 1038/GB/T 4937.20-2021
Weaknesses in the chip passivation structure or topology, as well as in edge sealing, are affected differently under humidity and electrical bias. Contaminants may also be transported by moisture into critical regions, potentially leading to failure.